An Enhanced Prognostic Model for Digital Electronics

This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as “hard” failures. In the paper we show how it has been validated for intermittent and “hard” solder joint interconnect failures under temperature cycling loads.